bipolar type led lamps LYG3362-PF doc. no : qw0905- rev. : date : - 2007 14 - mar. a LYG3362-PF data sheet pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
25.0min 1.5max note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. g 75 50 100 75 25 025 50 -60 2 1 -30 directivity radiation 0 30 1 1.0min 2.54typ 0.5 typ 100 60 2 y ligitek electronics co.,ltd. property of ligitek only 5.9 5.0 8.6 7.6 part no. LYG3362-PF package dimensions page 1/6
operating temperature -40 ~ +85 t opr peak wave length pnm viewing angle 2 1/2 (deg) LYG3362-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. 30 gap white diffused yellow gaasp/gap green emitted 35 lens 1.7 2.64.58.030 30 7.0 4.5 2.6 1.7 min. max. min. typ. storage temperature part no typical electrical & optical characteristics (ta=25 ) color material spectral halfwidth nm forward voltage @20ma(v) luminous intensity @10ma(mcd) -40 ~ +100 tstg page 2/6 absolute maximum ratings at ta=25 power dissipation peak forward current duty 1/10@10khz reverse current @5v forward current i f ma 30 20 ir 10 pd60 i fp 80 10 a 100 mw 120 ma absolute maximum ratings parameter y symbol g unit ligitek electronics co.,ltd. property of ligitek only 585 565 part no. LYG3362-PF
3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 wavelength (nm) 500 0.0 0.5 600650700 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 40 20 060100 80 ambient temperature( ) -40-20 02060 40100 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 2.0 fig.1 forward current vs. forward voltage forward voltage(v) 100 f o r w a r d c u r r e n t ( m a ) 1.0 0.1 10 1.0 y chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 3.04.05.0 3/6 page forward current(ma) 1.0101001000 part no. LYG3362-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip 4/6 part no. LYG3362-PF
260 c3sec max 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 preheat 2 /sec max 120 260 50 100 5 /sec max 150 time(sec) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) temp( c) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 5/6 part no. LYG3362-PF
reliability test: low temperature storage test high temperature storage test operating life test high temperature high humidity test thermal shock test solderability test solder resistance test the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-883:1008 jis c 7021: b-10 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) jis c 7021: b-12 ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test item test condition description reference standard page 6/6 part no. LYG3362-PF
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